Ion Beam sputter Deposition (IBSD)

  • High-end thin film deposition process
  • Lower pressure sputter deposition (10-4 Torr), sputtered atoms retain kinetic energy due to minimal scatting in low pressure environments
  • High quality, smooth, pin hole free films
  • Enhanced adhesion and micro-structure control
  • Yields excellent coverage at small thicknesses and on high aspect ratio features

 

sputtring

Typically, film properties from ion beam deposition exceed those deposited by evaporation or magnetron sputtering.

 

sputtring

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