Dicing Saw

Wafer dicing

Precision dicing saw for up to 8-inch wafers. Features rigid bridge frame and spindle support for minimized heat shrinkage and vibration during cutting.

Contacts: Mr. Mark Oksman, mark.oksman@biu.ac.il

Model:  DAD 3350

Manufacture:  Disco

Description:

Disco DAD3350 dicing saw is capable of handling up to 8-inch diameter workpieces. By adopting a high-rigidity bridge-type frame and a spindle front-section support structure, which prevents heat shrinkage and vibration, a more stable processing point can be achieved.

Specifications:

• Cutting speed 0.1-600 mm/s (depends on substrate type and thickness)
• Multiple-mounted workpieces option
• Index step 0.0001 mm (0.1 μ)
• Index positioning accuracy 0.002 mm (2 μ)
• Z-axis moving resolution 0.00005 mm (0.01 μ)
• Z-axis Repeatability accuracy 0.001 mm (1 μ)
• Spindle rotation speed range 6000-60000 rpm