ALD (Atomic Layer Deposition Systems)

Atomic Layer Deposition (ALD) enables the growth of ultra-thin, highly uniform films with atomic-scale thickness control. The technique provides exceptional conformality on complex and high-aspect-ratio structures and is suitable not only for planar substrates but also for non-conventional forms, including particulate and powder-based materials. These capabilities make ALD a powerful tool for advanced nanofabrication and functional surface engineering.

Contacts: Mrs. Dana Baram, dana.baram@biu.ac.il

Model: Savannah S200

Manufacture: Veeco

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Description:

The Savannah system employs Atomic Layer Deposition (ALD) technology to enable the growth of ultra-thin, highly uniform films with atomic-scale thickness control. This technique ensures excellent conformality, even on complex and high aspect-ratio structures, making it ideal for advanced nanofabrication processes.

Key Capabilities:

  • High-quality, conformal thin-film deposition
  • Atomic-level control over film thickness and composition
  • Flexible process temperature range suitable for various substrates
  • Compatibility with a wide range of precursors and functional materials

Typical Applications:

  • Micro and nanoelectronics
  • Photonic and optoelectronic devices
  • Sensors and nano sensors
  • Functional coatings and advanced interfaces
  • Materials science and quantum device research