ALD (Atomic Layer Deposition Systems)

English

ALD- Atomic Layer Deposition

Engineering of ultra-thin, conformal layers with atomic-level precision, for microelectronics, photonics, nanosensors and next-generation quantum.

Contacts: Mrs. Dana Baram, dana.baram@biu.ac.il

Model: Savannah S200

Manufacture: Veeco

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Description:

Atomic Layer Deposition (ALD) enables the growth of ultra-thin, highly uniform films with atomic-scale thickness control. The technique provides exceptional conformality on complex and high-aspect-ratio structures and is suitable not only for planar substrates but also for non-conventional forms, including particulate and powder-based materials. These capabilities make ALD a powerful tool for advanced nanofabrication and functional surface engineering.

Key Capabilities:

  • High-quality, conformal thin-film deposition

  • Atomic-level control over film thickness and composition

  • Flexible process temperature range suitable for various substrates

  • Compatibility with a wide range of precursors and functional materials

Typical Applications:

  • Micro and nanoelectronics

  • Photonic and optoelectronic devices

  • Sensors and nano sensors

  • Functional coatings and advanced interfaces

  • Materials science and quantum device research