Wafer Bonder

English

MEMS bonding & integration

Semi-automated wafer bonder for substrates up to 200mm. Supports MEMS, LED, and advanced 2.5D/3D integration with flexible substrate handling.
 
BINA's Fabrication Unit welcomes both industry professionals and researchers – providing state-of-the-art equipment, expert support, and customized solutions. We’re here for you!
 

Contacts: Mr. Mark Oksman mark.oksman@biu.ac.il

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Model:  SB6/8 Gen2

Manufacture:  SUSS MicroTec

Description: SB6/8 Gen2 SUSS MicroTec provides a semi-automated platform for multiple bonding processes. Handling wafers up to 200mm as well as various shapes and types of substrates. The SB6/8 Gen2 is suitable for packaging as well structuring, meeting the requirements for MEMS, LED, advanced packaging, 2,5D integration, and 3D integration.

Specifications:

  • Motorized z-Axis for recipe-controlled (no mechanical adjustment required)

  • Tool force piston design for best possible tool force uniformity

  • Bond force up to 20 kN

  • Temperature up to 550 °C

  • Precision temperature control (< 1 %) and unrivaled uniformity (± 2 %)

  • Precise process recipe control for all bond parameters

  • Fast heating and active cooling

  • Process chamber pressure range from 5 x 10-5 mbar to 1 bar (3 bar available as an option)