Packaging
Post-fabrication processing tools
BINA’s post-fabrication processing tools for wafer dicing and bonding, enabling advanced device integration and packaging.
Open to academia and industry, our facility supports final-stage processing for microelectronics, photonics, biomedical applications, and more.
Complete your fabrication process today - gr.biunano@biu.ac.il
Last Updated Date : 25/06/2025