Wafer Bonder
MEMS bonding & integration
Semi-automated wafer bonder for substrates up to 200mm. Supports MEMS, LED, and advanced 2.5D/3D integration with flexible substrate handling.
BINA's Fabrication Unit welcomes both industry professionals and researchers – providing state-of-the-art equipment, expert support, and customized solutions. We’re here for you!
Contacts: Mr. Mark Oksman mark.oksman@biu.ac.il
Model: SB6/8 Gen2
Manufacture: SUSS MicroTec
Description: SB6/8 Gen2 SUSS MicroTec provides a semi-automated platform for multiple bonding processes. Handling wafers up to 200mm as well as various shapes and types of substrates. The SB6/8 Gen2 is suitable for packaging as well structuring, meeting the requirements for MEMS, LED, advanced packaging, 2,5D integration, and 3D integration.
Specifications:
- Motorized z-Axis for recipe-controlled (no mechanical adjustment required)
- Tool force piston design for best possible tool force uniformity
- Bond force up to 20 kN
- Temperature up to 550 °C
- Precision temperature control (< 1 %) and unrivaled uniformity (± 2 %)
- Precise process recipe control for all bond parameters
- Fast heating and active cooling
- Process chamber pressure range from 5 x 10-5 mbar to 1 bar (3 bar available as an option)

Last Updated Date : 25/06/2025