Wafer Bonder

Contacts: Yossi Abulafia, yossi.abulafia@biu.ac.il

Model:  SB6/8 Gen2 Wafer Bonder

Manufacture:  SUSS Microtec

Description: SB6/8 Gen2 SUSS MicroTec provides a semi-automated platform for multiple bonding processes. Handling wafers up to 200mm as well as various shapes and types of substrates.  The SB6/8 Gen2 is suitable for packaging as well structuring meeting the requirements for MEMS, LED, advanced packaging, 2,5D integration, and 3D integration.

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