Wafer Bonder
Contacts: Yossi Abulafia, yossi.abulafia@biu.ac.il
Model: SB6/8 Gen2 Wafer Bonder
Manufacture: SUSS Microtec
Description: SB6/8 Gen2 SUSS MicroTec provides a semi-automated platform for multiple bonding processes. Handling wafers up to 200mm as well as various shapes and types of substrates. The SB6/8 Gen2 is suitable for packaging as well structuring meeting the requirements for MEMS, LED, advanced packaging, 2,5D integration, and 3D integration.
![Wafer Bonder](/sites/nano/files/styles/large/public/images/instrument/wafer_bonder.jpg?itok=MUaX7sWO)
תאריך עדכון אחרון : 15/02/2024