Wafer Bonder
Specifications:
Motorized z-Axis for recipe-controlled (no mechanical adjustment required)
Tool force piston design for best possible tool force uniformity
Bond force up to 20 kN
Temperature up to 550 °C
Precision temperature control (< 1 %) and unrivaled uniformity (± 2 %)
Precise process recipe control for all bond parameters
Fast heating and active cooling
Process chamber pressure range from 5 x 10-5 mbar to 1 bar (3 bar abs available as an option)
