Wafer Bonder
Specifications:
- Motorized z-Axis for recipe-controlled (no mechanical adjustment required)
- Gate valve and semi-automated load slide to load the transport fixture into the chamber
- Tool force piston design for best possible tool force uniformity
- Bond force up to 20 kN
- Temperature up to 550 °C
- Precision temperature control (< 1 %) and unrivaled uniformity (± 2 %)
- Precise process recipe control for all bond parameters
- Fast heating and active cooling
- Process chamber pressure range from 5 x 10-5 mbar to 1 bar (3 bar abs available as an option)
