PVD

Hybrid thin film deposition

Contacts: Mr. Moshe Feldberg, moshe.feldberg@biu.ac.il

Model:  Bestec, custom made

Manufacture:  Bestec

Description:

PVD system for thin layer deposition has 2 chambers (Thermal and Sputtering) and load lock (LL). The left chamber contains e-BEAM and thermal evaporation, the sputtering chamber (right one) contains 4 DC magnetrons sources and ion beam milling source. The Load-Lock is located between these 2 chambers to ensure interactive during transfer.

Specifications:

• Sputtering chamber equipped with 4 magnetrons DC (for conductors)
• Ion beam gun (for etching/ cleaning)
• Evaporation chamber equipped with e-beam gun (4 sources) and thermal evaporator (2 sources)
• Sample size - Up to 4”
• Load Lock and transferring chamber
• Sample rotation – up to 30rpm
• Heating during the process up to 400 °C

Available materials:                                                                   

Evaporation Materials-

Ag, Al₂O₃, Co, Cu, Cr, Fe, Ge, In, MgF₂, Mo, Pd, Pt, Si, SiO₂, Ta, Ti, Zn

Sputtering Materials-

Ag, Al, Al₂O₃, Au, C, Cu, Cr, Fe, In, Ge, ITO,Mn, MgF₂, Nb, Ni, NiO, Ni/Fe/Mo/Mn, Ni/Fe, Pt, SiO₂, Ta, Ti, TiO₂, ZnO