Ion Beam sputter Deposition (IBSD)
High-end thin film deposition process
Lower pressure sputter deposition (10-4 Torr), sputtered atoms retain kinetic energy due to minimal scatting in low pressure environments
High quality, smooth, pin hole free films
Enhanced adhesion and micro-structure control
Yields excellent coverage at small thicknesses and on high aspect ratio features
Typically, film properties from ion beam deposition exceed those deposited by evaporation or magnetron sputtering.
