Mask Aligner


  • High resolution and optimum edge quality
  • Various exposure modes, Soft, Hard and Vacuum, to meet any requirements for a broad range of applications
  • Proximity printing is applied to avoid any mask/wafer contact
  • The bottom side alignment
  • Wafer Size from 1” up to 150 mm
  • Substrate Size up to 6" x 6“
  • Pieces down to 5 x 5 mm
  • Resolution: down to 0.75 μ, mask and photoresist thickness dependent


<< Back