Mask Aligner

עברית

Specifications:

  • The SUSS MA/BA6 mask aligner designed for all standard lithography applications. For thick-resist MEMS applications, the MA/BA6 offers high resolution and optimum edge quality.
  • The MA/BA6 offers various exposure modes to meet any requirements for a broad range of applications.
  • Soft, hard and vacuum contact printing is used to achieve highest resolution down to submicron range.
  • Proximity printing is applied to avoid any mask/wafer contact.
  • The bottom side alignment option allows for pattern printing on both sides of the substrate and widely used for MEMS applications.
  • Wafer Size from 1” up to 150 mm
  • Substrate Size up to 6" x 6“
  • Pieces down to 5 x 5 mm
  • Resolution: down to 0.75 μ, mask and photoresist thickness dependent

 

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