Mask Aligner
Specifications:
- High resolution and optimum edge quality
- Various exposure modes, Soft, Hard and Vacuum, to meet any requirements for a broad range of applications
- Proximity printing is applied to avoid any mask/wafer contact
- The bottom side alignment
- Wafer Size from 1” up to 150 mm
- Substrate Size up to 6" x 6“
- Pieces down to 5 x 5 mm
- Resolution: down to 0.75 μ, mask and photoresist thickness dependent
