PVD system (Magnetron, Thermal and E-BEAM)

Specifications:

  • Sputtering with 4 magnetrons RF/DC
    • RF (For Isolators and semiconductors)
    • DC (For conductors)
  • Ion Beam (For etching)
  • Evaporation with E-beam (4 sources) and thermal (2 sources)
  • Sample size - Up to 4”
  • Load Lock and transferring chamber
  • Sample rotation – up to 30rpm

 

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