PVD system (Sputtering, Thermal and e-Beam evaporation)
Specifications:
- Sputtering chamber equipped with 4 magnetrons DC (for conductors)
- Ion beam gun (for etching/ cleaning)
- Evaporation chamber equipped with e-beam gun (4 sources) and thermal evaporator (2 sources)
- Sample size - Up to 4”
- Load Lock and transferring chamber
- Sample rotation – up to 30rpm
- Heating during the process up to 400 °C
Available materials:
Evaporation Materials-
Ag, Al₂O₃, Co, Cu, Cr, Fe, Ge, In, MgF₂, Mo, Pd, Pt, Si, SiO₂, Ta, Ti, Zn
Sputtering Materials-
Ag, Al, Al₂O₃, Au, C, Cu, Cr, Fe, In, Ge, ITO,Mn, MgF₂, Nb, Ni, NiO, Ni/Fe/Mo/Mn, Ni/Fe, Pt, SiO₂, Ta, Ti, TiO₂, ZnO
