FIB
Description:
Dual-beam system combining SEM and FIB for high-resolution imaging, cross-sectioning, material analysis, and 3D reconstruction. Ideal for TEM sample prep, device modification, failure analysis, and tomography. Includes EDX and cryo-stage.
Resolution:
Electron beam: 0.6 nm at 15 kV; 1.2 nm at 1 kV
Ion beam at coincident point: 4.0 nm at 30 kV
Specifications:
- Electron beam current range: 1.6 pA to 100 nA
- Accelerating voltage range:350 V – 30 kV
- Ion beam current range: 1 pA – 100 nA
- Accelerating voltage range: 500 V – 30 kV
Analytical and imaging detectors:
- Secondary electrons detectors
- Secondary ions detector
- Backscattered electrons detectors
- Electron detector for STEM
- X-ray detector for energy-dispersive X-ray spectroscopy
