Spinners, Hot Plates, Plasma Chamber

• Spin coater for wafer drying and coating

                   •Up to 6000rpm

                   •Programmable process time, speed, acceleration

                   •Vacuum and low contact chuck

•  High Precision Hot Plates and Oven

                  •Up to 450°C Hot Plates

                  • PID controller, and fan cooled working area.

• Plasma Chamber for cleaning and Activation

                   •Programable process.

                   • 3 gases, O2, Ar, N2