עברית Tell a Friend

Reactive Ion etcher

    .

Specifications
  • Semi-Automatic Load Lock for single wafer
  • ICP-II source with 2.5KW/2MHz RF source
  • Low temperature heat exchanger down to -40°C
  • 12 gas lines for Chlorine and Fluorine process
  • OES Endpoint and Laser Endpoint for process control 
Reactive Ion etcher

Last Updated Date : 22/08/2021